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1、SPECIALSECTIONONADVANCESINELECTRONICSSYSTEMSSIMULATIONModellingandsimulationtechniquesforhighlyintegrated,low-powerwirelesssensornetworksB.Otis,S.Gambini,R.Shah,D.Steingart,E.Que′vy,J.Rabaey,A.Sangiovanni-VincentelliandP.WrightAbstract:Thedesignofstate-of-t

2、he-artlow-powerwirelesssensornodesinvolvestheconvergenceofmanytechnologiesanddisciplines.Submicroncomplementarymetaloxidesemiconductor(CMOS)devices,micro-electro-mechanicalsystem?lters,on-andoff-chipelectromagneticelements,sensorsandthin-?lmbatteriesaresome

3、ofthetechnologiesthatwillenablepervasivesystemssuchaswirelesssensornetworks.Highsystemcomplexityrequirestheuseofmanysimu-lationenvironmentduringdesign:algorithmsimulators,mechanical?niteelementanalysis,beha-viouralandtransistor-levelcircuitsimulators,electr

4、omagnetic(EM)simulators,thin-?lmbatterysimulatorsandnetworksimulators.Itisshownthathighlyintegrated,self-containedsystemsrequiremultiple-domainsimulationstouncovercomplexinteractionsbetweendomains.Speci?cexamplesofblock-andsystem-leveldesignmethodologiesuse

5、dinlow-powerwirelesssystemsarepresentedhere.Bottlenecksinthecurrentmethodologywillbeidenti?edwithaneyetowardsimprovingthescopeandresolutionofsystem-levelsimulations.1IntroductionToallowdiversecon?gurationsinthesensorsandpowersourcesofthenodes,amodularapproa

6、chisdesirable.ThisRecently,theemergingconceptofAmbientIntelligencehaswouldallow,forexample,asolarenergyscavengerforpromisedtochangethewayhumaninteractwithtechnologyoutdoorapplicationsandavibrationalenergyscavengerfor[1].Thistechnologywillbereactiveanddistri

7、buted,afford-darkbutnoisyindustrialenvironment.Thisisasubstantialinghighlevelsofredundancyand?nespatialgranularity.departurefromtraditionalchip-on-PCBpackaging.InTheheartofthismovementisrootedinextremelysmall,addition,eachofthetechnologiesthatareintegratedo

8、nthisinexpensiveandubiquitouswirelesssensors.Thelevelofplatformisexperimentalandunproveninisolation.Thisdif?cultyofimplementingasuitablehardwareplatformisincreasesthelevelofuncertaintyandtheneedforcomp